Welcome to the official website of Mindup Technoloogy

WeChatScan and follow the official WeChat 中文 English

Shenzhen Mindup Technology Co., Ltd.

Product

MLB Bonding Machine

Applications:Before the multi-layer PCB board are pressed, the PIN is aligned, and the pre-alignment and pre-bonding function between the core board and the core board is realized by the electric heating and melting of the prepreg

Manufacturer:HANSONG

Place of Origin:Korea

Service Hotline:+86 755 2996 9595

Product manual
1, Application
Multilayer PCB board laminated to PIN registration mode, by an electrical prepreg between the cooling heating and melting the core plate, and to achieve a pre-alignment function between pre-glued core plate and core plate

2 Product specifications
Plate size: Max: 800mm × 660mm, Minimum: 320mm × 320mm (customizable)
Number of hot melt heads: 32 (customizable)
Number of panels: Mainly for 6-16 laminate
Hot melt head Dimensions: Rectangular 5×16mm or round φ8mm (other sizes can be customized)
Equipment size: 1800mm(L)×1100mm(W)×1620mm(H)

3. Features
Double-table switching, reducing waiting time and improving production efficiency
PP heating and core plate fixing by electric heating method
Each temperature of the hot melt head is independently controlled and compensated separately to improve the consistency of hot melt temperature.
Hard anode treatment work surface, high stability
Laser guide hot melt head pressing position, convenient for on-site processing to improve operational efficiency