1.Product application
Complete the circuit copper plating thickening on the surface of the circuit board, which can be used for full-plate plating, pattern plating blind hole or through-hole filling plating

2. Product specifications
Plate size: 515mm × 625mm max (can be customized)
Thickness capability : 0.034~0.8mm
Blind hole capacity: 50um min Thickness ratio maximum 1:1
Through hole capacity: 60um min Thickness ratio maximum 6:1
Output capacity: ≥1100pnl/day

3. product features
Plating uniformity and filling Hole capacity, custom electrode design
Fully automatic addition system, CuO automatic addition and dustproof design
Easy maintenance of equipment and rapid product switching
Fully automatic upper and lower plates reduce manual clamping damage